EDSYN ALM 2010 - Peelable solder mask

"flexible solder resist mask Again and again the problem arises that areas of the printed circuit board, for example, must not be soldered with the wave soldering machine or processed with varnishing systems. For this purpose, we would like to offer you our new solder resist mask ALM 2010 after more and more frequent inquiries from the electronics processing industry. It is a high solid latex product for temporary, temporary coverage. The fast drying of the ALM 2010 removable solder resist mask of 1 hour is shortened by higher temperatures (up to 265°C). \ \ As soon as the solder resist mask has dried, the circuit board is further processed. Solids content:high solids content, approx. 60 Advantages: excellent strength good adhesion high thermal resistance lower tendency to bridge Viscosity of approximately 20,000 cps high solids content fast desiccation Storage at 5-32°C up to 6 months with closed bottle possible Do not use on copper surfaces! "