RPI COOL CM5 - Raspberry Pi - Heat sink for Compute Module 5, black

"The aluminum heatsink is specifically designed for the Compute Module 5 and comes with thermal pads to ensure maximum heat transfer from the CPU, memory, wireless module (if present) and eMMC memory (if present) to the heatsink. Aluminum heatsink, suitable for the Compute Module 5 Including thermal pads for optimum heat transfer Cooling for CPU, memory, wireless module and eMMC (if present) The heat sink ensures effective dissipation of the heat generated, which improves the thermal stability and performance of the Compute Module 5. The included thermal pads maximize the contact between the components and the heat sink to ensure efficient heat dissipation. Conclusion: The aluminum heat sink is an ideal solution for improving the thermal performance of the Compute Module 5 and ensures reliable cooling for all essential components."